Our Mission

Our day-to-day commitment is to provide the best quality, best delivery and the best attention to every detail of our business that is humanly possible.

We promise to remain in the forefront of technology, seeking new and innovative ways to “get the job done right”… this is our pledge.

SAFE ‘T’ PAK

New “ISTA” Approved Packaging

New Development for Wafer Transportation.

The SPI/Semicon SAFE “T” PAK meets ISTA

(International Safe Transit Association)

License# 1229

SAFE “T” PAK-6 Package Contents

• 2 CEN 6-inch wafer containers capable of holding 25 wafers
• 26 TyvekWafer Interleafs
• 5 Foam Wafer Cushions
• 1 Foam Liners
• 1 each 18″x12″x6″ Corrugated Carton
• 2 each 18″x12″x2″ Top and Bottom Foam Cushions
• 1 each 18″x12″x2″ Foam Cushion with cutouts for container

SAFE “T” PAK-8 Package Contents

• 2 CEN 8-inch wafer containers capable of holding 25 wafers
• 26 Tyvek Wafer Interleafs
• 5 Foam Wafer Cushions
• 1 Foam Liner
• 1 each 24″x14″x6″ Corrugated Carton
• 2 each 24″x14″6″ Top and Bottom Foam Cushions
• 1 each 24″x14″x2″ Foam Cushion with cutouts for container.

*Different foam and interleaf materials available

Wafer Separator Rings

Overview

Texchem Advanced Products introduces the new 200mm and 300mm Wafer Separator Rings for use with our Bumped HWS (BHWS) and RM series of Horizontal WaferShippers^TM.  The WSR-R series Separator Rings are designed for transporting Bumped Wafers so that contact is only made within the SEMI Standard Exclusion Zone.   Extensive Finite Element Modeling and testing shows that our unique ring design offers superior wafer protection.

In certain cases, the customer may even elect to use our Wafer Separator Rings to eliminate the carbon or non-woven interleaves from their non-bumped wafers, so there is no contact with the finished circuitry on the wafers.  Now Texchem Advanced Products makes the decision yours.

The WSR-R series Rings can be used to transport up to 25 full thickness bumped wafers using our BHWS WaferShippers or 13 full thickness bumped wafers using our HWS-RM WaferShippers.  Either way, when these Wafer Separator Rings are used with our unique, patent pending moveable wall design the wafers will be securely held as the cover is closed.  The WaferShipper^TM provides unprecedented lateral shock absorption by holding an entire stack of wafers radially.  External forces and impacts are effectively directed to the shipper itself while the wafers remain safe.

By working closely with our material suppliers we develop the cleanest materials for ionics and outgassing, resulting in an ultra clean, carbon filled polypropylene that provides ESD protection.

Features

• Designed specifically for use with our BHWS and HWS-RM Horizontal Wafer Shippers
• Manufactured with the industry’s cleanest, high-purity polypropylene material
• Minimal outgassing, trace metals, and ionics
• Unparalleled shipping and impact protection
• Compatible with automated packing/unpacking/sorting equipment
• Up to 25 Wafers can be housed using our BHWS WaferShippers
• Up to 13 Bumped Wafers can be housed using our HWS-RM WaferShippers

Specifications:

Wafer Shipping Packing Instructions

Recommended packing method for SPI/Semicon wafer containers

Each wafer jar requires a foam liner, foam cushion discs, and wafer interleaf disc to effectively protect wafers during transport.

Follow these steps

1. Insert the Foam Liner around the inside wall of the wafer jar.
2. Place two Foam Cushion Discs in bottom of wafer jar.
3. Place Wafer Interleaf Disc on top of foam disc.
4. Place one wafer on top of Interleaf and continue putting an Interleaf Disc between each wafer as wafer jar is loaded.
5. Place Wafer Interleaf Disc on top of the last wafer loaded into jar.
6. Fill any empty space in top of jar with Foam Cushion Discs.

IMPORTANT NOTE: To prevent wafer breakage it is critical that the jar is “overfilled” by the thickness of the Foam Cushion Discs. This overfill creates a light compression on wafers when the lid is snapped onto the jar. The compression prevents wafer movement inside the jar which helps to prevent wafer damage. Please note – this “overfilling” procedure is to be used only with the soft foam cushions. When using firm foam in the container overfilling the container can cause breakage of the wafers. Over filling with firm foam can also cause the lid of the container not to seat properly and come off in transport.

The above instructions are intended for packing the 1-1/2″ deep wafer jar with up to 25 wafer. When packing 3″ deep jar with more than 25(up to 50) wafers place Foam Cushion Disc every five wafers.

Wafer Shipping Systems

Wafercon200

The SPI/Semicon Wafer Storage and Shipping Systems includes A Wafer Jar and Lid, Foam Liner, Foam Cushion Discs, and Wafer Interleaf Discs.

Wafer Jars and Lids

Jars and Lids are manufactured from virgin polypropylene resin-no fillers or additives. Material is chemically resistant and has high impact strength.

Foam Liners

Manufactured from 1.25 LB density pink polyurethane antistatic foam. This product is non-corrosive, has excellent cushion properties, and low particle generation. Surface Resistivity (ASTM D256) measures 10 Ohms/Sq. Meets MIL-B-81705 Static Decay Requirement (0% Cutoff) FTMS 101C, 4046 <2 Seconds.

Foam Cushion Discs

Produced from same materials as Foam Liners.

Wafer Interleaf Disc

Paper Disc: 100% Cellulose, Laboratory Grade Low-Lint Filter Paper. Low Sodium (169 PPM) and Sulfur (15-60 PPM) content.

Tyvek Discs: Spunbonded Olefin, tear proof non-particulating. Extremely low Sodium (1 PPM) and Sulfur (1 PPM) content. Special grade resists triboelectric charging.

Note: All of the above products are produced without CFCs or ODCs.

CEN Wafer Containers

8″ Wafer Containers

5 & 6″ Wafer Containers

3 & 4″ Wafer Containers

Sales & Service Team

John Santoro, Regional Sales Manager

2175 Kruse Drive

San Jose, CA 95131

Tel: 408.597.0650 ext 651

Fax: 408.434.9426

Toll Free: 1.800.432.2212 ext. 651

Al Strohscher, Central-North East-South East

1925 East Beltline Road, STE #509

Carrolton, TX 75006

Tel: 877.774.7364

Fax: 877.477.4329

Rosa Vallejo, Customer Service/Inside Sales

2960 Commerce Way

Ogden, UT 84401

Tel: 801.399.5723

Fax: 801.393.7559

Toll Free: 888.295.5906

David Lim, Managing Director, SPI/Semicon Asia

Blk-2 Lot3-9

Phase 3, Peza Drive, Bgy.Langkaan

Dasmarinas, Cavite, Philippines

Tel: 6346.402.0354

Fax: 6346.402.0252