IC Shipping Tubes

IC Shipping Tubes

• Manufactured in our new Utah facility on state-of the-art equipment.
• Precision plastic profiles to your specifications.
• On-line printing and cut lengths controlled by microprocessors.
• All above profiles and many more are presently tooled and available for quick delivery.
• New or custom shaped will be quoted promptly

200 mm VWS WaferShipper

200 mm VWS WaferShipper™

Overview

The Texchem Advanced Products 200mm VWS Vertical WaferShiper™ is an industry accepted design providing superior protection for critical wafer handling requirements.  The 200mm VWS is designed for transporting up to 25 full thickness wafers inside of a standardized vertical orientation package.  By working closely with our material suppliers we develop the cleanest materials for low ionics and outgassing, resulting in an ultra clean, polypropylene material for prime wafer handling.

The 200mm VWS WaferShipper™ is designed to closely match the exterior and interior cassette package size of existing products that are widely used in the industry with components that are compatible with automated wafer loading and unloading equipment.

Features

• Package size and dimensions closely matches existing products that are widely used in the industry
• Manufactured with the industry’s cleanest, high-purity polypropylene material
• Minimal outgassing, trace metals, and ionics
• Unparalleled shipping and impact protection
• Secure, easy to use assembly.
• Orientation features for proper cassette/base alignment
• Compatible with automated loading and unloading equipment
• Houses up to 25 Wafers
• Competitively Priced

Specifications

• L x W x H: 263mm x 260mm x 237mm
• Each package is double clean room bagged
• Part name: 200mm VWS
• Part number: VWS200-A1

200mm BHWS WaferShipper

200mm BHWS WaferShipper™

Overview

The Texchem Advanced Products 200mm Bumped Horizontal WaferShiper™ is a unique design providing superior protection versus competitor HWS models. The 200mm BHWS is designed for transporting up to 25 full thickness “Bumped” wafers using our Wafer Separator Rings (pn WSR200-R1). By working closely with our material suppliers we develop the cleanest materials for ionics and outgassing, resulting in an ultra clean, carbon filled polypropylene that provides ESD protection.

The 200mm BHWS WaferShipper™ is designed to be compatible with most automated wafer packing, unpacking, and sorting equipment.

Our unique, patent pending moveable wall design secures the wafers as the cover is closed.  The edge-grip support “hugs” the wafers, limiting wafer movement and reducing particle generation. The WaferShipper™ provides unprecedented lateral shock protection by holding the entire stack of wafers radially, unlike competitor models which offer either no radial protection, or only hold the top several wafers. External forces and impacts are effectively directed to the shipper itself while the wafers remain safe.

 Features

• Manufactured with the industry’s cleanest, high-purity polypropylene material
• Minimal outgassing, trace metals, and ionics
• Unparalleled shipping and impact protection
• Edge-grip support “hugs” the wafers, limiting wafer movement and reducing particulation
• Secure, easy to use four latch locking mechanism
• Arrowed, notch feature for proper top/base alignment
• RF Tag Housing in the base for inventory and process management
• Compatible with automated packing/unpacking/sorting equipment
• Houses 1-25 Wafers using Wafer Separator Rings (pn WSR200-R1)

Specifications

• L x W x H: 226mm x 226mm x 69mm
• Internal Height
• Each package is double clean room bagged
• Part name: 200mm BHWS
• Part number: BHWS200-A5
• Ring part number: WSR200-R1

Wafer Shipping Packing Instructions

Recommended packing method for SPI/Semicon wafer containers

Each wafer jar requires a foam liner, foam cushion discs, and wafer interleaf disc to effectively protect wafers during transport.

Follow these steps

1. Insert the Foam Liner around the inside wall of the wafer jar.
2. Place two Foam Cushion Discs in bottom of wafer jar.
3. Place Wafer Interleaf Disc on top of foam disc.
4. Place one wafer on top of Interleaf and continue putting an Interleaf Disc between each wafer as wafer jar is loaded.
5. Place Wafer Interleaf Disc on top of the last wafer loaded into jar.
6. Fill any empty space in top of jar with Foam Cushion Discs.

IMPORTANT NOTE: To prevent wafer breakage it is critical that the jar is “overfilled” by the thickness of the Foam Cushion Discs. This overfill creates a light compression on wafers when the lid is snapped onto the jar. The compression prevents wafer movement inside the jar which helps to prevent wafer damage. Please note – this “overfilling” procedure is to be used only with the soft foam cushions. When using firm foam in the container overfilling the container can cause breakage of the wafers. Over filling with firm foam can also cause the lid of the container not to seat properly and come off in transport.

The above instructions are intended for packing the 1-1/2″ deep wafer jar with up to 25 wafer. When packing 3″ deep jar with more than 25(up to 50) wafers place Foam Cushion Disc every five wafers.

Wafer Shipping Systems

Wafercon200

The SPI/Semicon Wafer Storage and Shipping Systems includes A Wafer Jar and Lid, Foam Liner, Foam Cushion Discs, and Wafer Interleaf Discs.

Wafer Jars and Lids

Jars and Lids are manufactured from virgin polypropylene resin-no fillers or additives. Material is chemically resistant and has high impact strength.

Foam Liners

Manufactured from 1.25 LB density pink polyurethane antistatic foam. This product is non-corrosive, has excellent cushion properties, and low particle generation. Surface Resistivity (ASTM D256) measures 10 Ohms/Sq. Meets MIL-B-81705 Static Decay Requirement (0% Cutoff) FTMS 101C, 4046 <2 Seconds.

Foam Cushion Discs

Produced from same materials as Foam Liners.

Wafer Interleaf Disc

Paper Disc: 100% Cellulose, Laboratory Grade Low-Lint Filter Paper. Low Sodium (169 PPM) and Sulfur (15-60 PPM) content.

Tyvek Discs: Spunbonded Olefin, tear proof non-particulating. Extremely low Sodium (1 PPM) and Sulfur (1 PPM) content. Special grade resists triboelectric charging.

Note: All of the above products are produced without CFCs or ODCs.

CEN Wafer Containers