Browsing articles from "November, 2011"

Our Mission

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Our day-to-day commitment is to provide the best quality, best delivery and the best attention to every detail of our business that is humanly possible.

 

We promise to remain in the forefront of technology, seeking new and innovative ways to “get the job done right”… this is our pledge.

SAFE ‘T’ PAK

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New “ISTA” Approved Packaging

New Development for Wafer Transportation.

The SPI/Semicon SAFE “T” PAK meets ISTA

(International Safe Transit Association)

License# 1229

 

SAFE “T” PAK-6 Package Contents

  • 2 CEN 6-inch wafer containers capable of holding 25 wafers
  • 26 TyvekWafer Interleafs
  • 5 Foam Wafer Cushions
  • 1 Foam Liners
  • 1 each 18″x12″x6″ Corrugated Carton
  • 2 each 18″x12″x2″ Top and Bottom Foam Cushions
  • 1 each 18″x12″x2″ Foam Cushion with cutouts for container

 

SAFE “T” PAK-8 Package Contents

  • 2 CEN 8-inch wafer containers capable of holding 25 wafers
  • 26 Tyvek Wafer Interleafs
  • 5 Foam Wafer Cushions
  • 1 Foam Liner
  • 1 each 24″x14″x6″ Corrugated Carton
  • 2 each 24″x14″6″ Top and Bottom Foam Cushions
  • 1 each 24″x14″x2″ Foam Cushion with cutouts for container.

*Different foam and interleaf materials available

Wafer Separator Rings

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Overview

Texchem Advanced Products introduces the new 200mm and 300mm Wafer Separator Rings for use with our Bumped HWS (BHWS) and RM series of Horizontal WaferShippersTM.  The WSR-R series Separator Rings are designed for transporting Bumped Wafers so that contact is only made within the SEMI Standard Exclusion Zone.   Extensive Finite Element Modeling and testing shows that our unique ring design offers superior wafer protection.

In certain cases, the customer may even elect to use our Wafer Separator Rings to eliminate the carbon or non-woven interleaves from their non-bumped wafers, so there is no contact with the finished circuitry on the wafers.  Now Texchem Advanced Products makes the decision yours.

The WSR-R series Rings can be used to transport up to 25 full thickness bumped wafers using our BHWS WaferShippers or 13 full thickness bumped wafers using our HWS-RM WaferShippers.  Either way, when these Wafer Separator Rings are used with our unique, patent pending moveable wall design the wafers will be securely held as the cover is closed.  The WaferShipperTM provides unprecedented lateral shock absorption by holding an entire stack of wafers radially.  External forces and impacts are effectively directed to the shipper itself while the wafers remain safe.

By working closely with our material suppliers we develop the cleanest materials for ionics and outgassing, resulting in an ultra clean, carbon filled polypropylene that provides ESD protection.

Features

  • Designed specifically for use with our BHWS and HWS-RM Horizontal Wafer Shippers
  • Manufactured with the industry’s cleanest, high-purity polypropylene material
  • Minimal outgassing, trace metals, and ionics
  • Unparalleled shipping and impact protection
  • Compatible with automated packing/unpacking/sorting equipment
  • Up to 25 Wafers can be housed using our BHWS WaferShippers
  • Up to 13 Bumped Wafers can be housed using our HWS-RM WaferShippers

 

Specifications:

Products Used For

Size (OD x ID)

Step Height

Wafer Spacing

200mm BHWS

200mm HWS-RM

200mm x 178mm

0.8 mm

1.8 mm

300mm HWS-RM

300mm x 278mm

0.8 mm

1.8 mm

Wafer Shipping Packing Instructions

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Recommended packing method for SPI/Semicon wafer containers

 

Each wafer jar requires a foam liner, foam cushion discs, and wafer interleaf disc to effectively protect wafers during transport.

 

Follow these steps

  1. Insert the Foam Liner around the inside wall of the wafer jar.
  2. Place two Foam Cushion Discs in bottom of wafer jar.
  3. Place Wafer Interleaf Disc on top of foam disc.
  4. Place one wafer on top of Interleaf and continue putting an Interleaf Disc between each wafer as wafer jar is loaded.
  5. Place Wafer Interleaf Disc on top of the last wafer loaded into jar.
  6. Fill any empty space in top of jar with Foam Cushion Discs.

 

IMPORTANT NOTE: To prevent wafer breakage it is critical that the jar is “overfilled” by the thickness of the Foam Cushion Discs. This overfill creates a light compression on wafers when the lid is snapped onto the jar. The compression prevents wafer movement inside the jar which helps to prevent wafer damage. Please note – this “overfilling” procedure is to be used only with the soft foam cushions. When using firm foam in the container overfilling the container can cause breakage of the wafers. Over filling with firm foam can also cause the lid of the container not to seat properly and come off in transport.

 

The above instructions are intended for packing the 1-1/2″ deep wafer jar with up to 25 wafer. When packing 3″ deep jar with more than 25(up to 50) wafers place Foam Cushion Disc every five wafers.

Wafer Shipping Systems

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Wafercon200

The SPI/Semicon Wafer Storage and Shipping Systems includes A Wafer Jar and Lid, Foam Liner, Foam Cushion Discs, and Wafer Interleaf Discs.

Wafer Jars and Lids

Jars and Lids are manufactured from virgin polypropylene resin-no fillers or additives. Material is chemically resistant and has high impact strength.

Foam Liners

Manufactured from 1.25 LB density pink polyurethane antistatic foam. This product is non-corrosive, has excellent cushion properties, and low particle generation. Surface Resistivity (ASTM D256) measures 10 Ohms/Sq. Meets MIL-B-81705 Static Decay Requirement (0% Cutoff) FTMS 101C, 4046 <2 Seconds.

Foam Cushion Discs

Produced from same materials as Foam Liners.

Wafer Interleaf Disc

Paper Disc: 100% Cellulose, Laboratory Grade Low-Lint Filter Paper. Low Sodium (169 PPM) and Sulfur (15-60 PPM) content.

Tyvek Discs: Spunbonded Olefin, tear proof non-particulating. Extremely low Sodium (1 PPM) and Sulfur (1 PPM) content. Special grade resists triboelectric charging.

 

Note: All of the above products are produced without CFCs or ODCs.

CEN Wafer Containers

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For 6″ (150mm) Wafers

Single Wall and Triple Wall Container, Lid & Pin

Part Number                  Description                                                                                          Standard Package            

Single Wall

WC-CEN-6 Conductive 1 1/2″ Deep Container Jar, Lid and Pin 20 Per carton
WC-CEN-6A NON Conductive 1 1/2″ Deep Container Jar, Lid and Pin 20 Per carton

Triple Wall

WC-CEN-6TW Triple Wall Conductive 1 1/2″ Deep Container Jar, Lid & Pin 20 Per carton
WC-CEN-6TWA Triple Wall NON Conductive 1 1/2″ Deep Container Jar, Lid & Pin 20 Per carton

Locking Pins

CEN-LPC Conductive Locking Pins 100 per carton
CEN-LPA NON Conductive Locking Pins 100 per carton

Foam Liner

ASL-2601 Anti-Static Foam Liner 20 Per Bundle

Foam Cushion

AFD-2601 Anti-Static Foam Cushion 500 Per Carton

Interleaf

TVK-3006 Tyvek Interleaf Disc 500 Per Pack

For 8″ (200mm) Wafers

Single Wall and Triple Wall Container, Lid & Pin

Part Number Description Standard Package

Single Wall

WC-CEN-8 Conductive 1 1/2″ Deep Container Jar, Lid and Pin 20 Per carton
WC-CEN-8A NON Conductive 1 1/2″ Deep Container Jar, Lid and Pin 20 Per carton

Triple Wall

WC-CEN-8TW Triple Wall Conductive 1 1/2″ Deep Container Jar, Lid & Pin 20 Per carton
WC-CEN-8TWA Triple Wall NON Conductive 1 1/2″ Deep Container Jar, Lid & Pin 20 Per carton

Additional Locking Pins

CEN-LPC Conductive Locking Pins 100 per carton
CEN-LPA NON Conductive Locking Pins 100 per carton

Foam Liner

ASL-2801 Anti-Static Foam Liner 20 Per Bundle

Foam Cushion

AFD-2801 Anti-Static Foam Cushion 500 Per Carton

Interleaf

TVK-3008 Tyvek Interleaf Disc 500 Per Pack

 

 

8″ Wafer Containers

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For 8″ (200mm) Wafers Jars and Lids

Part Number              Description                                                      Standard Package          
WMJ-1801 TL 2″ Deep Wafer Jar with Twist Lock Lid* 20 per case

Foam Liner

ASL-2801P Anti-Static Foam Liner 20 per bundle

Interleaf

HPD-3008 Filter Interleaf Disc 500 per pak
TVK-3008 Tyvek Interleaf Dics 500 per pak

Foam Cushion

AFD-2801P Anti-Static Foam Cushion 500 per carton
Containers feature a Twist Lock lid for ease of opening and closing

 

5 & 6″ Wafer Containers

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For 5″ (125mm) Wafers Jars and Lids

Part Number             Description                                             Standard Package               
WMJ-1501 J, L 1-1/2″ Deep Wafer Jar and Lid 50 per case
WMJ-1502 J, L 3″ Deep Wafer Jar and Lid 50 per case

Foam Liner

ASL-2501P Anti-Static Foam Liner For 1501 Jar 50 per bundle
ASL-2502P Anti-Static Foam Liner For 1502 Jar 50 per bundle

Interleaf

HPD-3005 Filter Interleaf Disc 1000 per pak
TVK-3005 Tyvek Interleaf Disc 500 per pak

Foam Cushion

AFD-2501P Anti-Static Foam Cushion 1000 per pak

For 6″ (150mm) Wafers Jars and Lids

Part Number Description Standard Package
WMJ-1601 J, L 1-1/2″ Deep Wafer Jar and Lid 50 per case
WMJ-1602 J, L 3″ Deep Wafer Jar and Lid 50 per case

Foam Liner

ASL-2601P Anti-Static Foam Liner For 1501 Jar 50 per bundle
ASL-2602P Anti-Static Foam Liner For 1502 Jar 50 per bundle

Interleaf

HPD-3006 Filter Interleaf Disc 1000 per pak
TVK-3006 Tyvek Interleaf Disc 500 per pak

Foam Cushion

AFD-2601P Anti-Static Foam Cushion 1000 per pak
Containers feature a Snap-On lid

 

3 & 4″ Wafer Containers

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For 3″ (75mm) Wafers Jars and Lids

Part Number Description Standard Package
WMJ-1034 1-1/2″ Deep Wafer Jar 350 per case
WMJ-1038 3″ Deep Wafer Jar 200 per case
WML-1030 Lid for Wafer Jar 500 per case

Interleaf

HPD-3003 Filter Interleaf Disc 1000 per pak
TVK-3003 Tyvek Interleaf Disc 500 per pak

Foam Cushion

AFD-2301P Anti-Static Foam Cushion 2000 per carton

For 4″ (100mm) Wafers Jars and Lids

Part Number           Description                          Standard Package          
WMJ-1412 1-1/2″ Deep Wafer Jar 120 per case
WMJ-1424 3″ Deep Wafer Jar 100 per case
WML-1400 Lid for Wafer Jar 150 per case

Interleaf

HPD-3004 Filter Interleaf Disc 1000 per pak
TVK-3004 Tyvek Interleaf Disc 500 per pak

Foam Cushion

AFD-2401P Anti-Static Foam Cushion 2000 per carton
Containers feature a Screw-On lid

Sales & Service Team

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John Santoro, Regional Sales Manager

2175 Kruse Drive

San Jose, CA 95131

Tel: 408.597.0650 ext 651

Fax: 408.434.9426

Toll Free: 1.800.432.2212 ext. 651

 

Al Strohscher, Central-North East-South East

1925 East Beltline Road, STE #509

Carrolton, TX 75006

Tel: 877.774.7364

Fax: 877.477.4329

 

Rosa Vallejo, Customer Service/Inside Sales

2960 Commerce Way

Ogden, UT 84401

Tel: 801.399.5723

Fax: 801.393.7559

Toll Free: 888.295.5906

 

David Lim, Managing Director, SPI/Semicon Asia

Blk-2 Lot3-9

Phase 3, Peza Drive, Bgy.Langkaan

Dasmarinas, Cavite, Philippines

Tel: 6346.402.0354

Fax: 6346.402.0252

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Corporate Headquarters

2670 South Commerce Way
Ogden, UT 84401
Tel: 801.399.5723
Fax: 801.393.7559
Toll Free: 1.888.295.5906

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