Innovating Semiconductor Packaging Since 1970

At SPI/Semicon, we specialize in advanced semiconductor packaging — from front-end wafer fabrication to back-end finished devices. Our expertise spans decades of innovation, precision, and customer-focused engineering.

Formed through the merger of two industry leaders, Semicon Systems and Semiconductor Products, we’ve built a global reputation for excellence. With state-of-the-art facilities in the U.S. and Philippines, advanced manufacturing methods, and a commitment to quality, we deliver high-performance solutions that power technology worldwide.

Our unmatched packaging options, unique product designs, and exceptional service consistently exceed the highest industry standards. From vacuum forming and extrusion to die-cutting and custom-made parts, every product we deliver reflects our dedication to precision and reliability.

At SPI/Semicon, service and quality drive everything we do. Our ISO 9001 certification ensures our processes meet the most rigorous global standards; giving our customers confidence in every component we produce.

SPI/Semicon — Engineering the future of semiconductor packaging.

Delivering reliable semiconductor packaging solutions that power the world’s technology.