Wafer Separator Rings are specifically designed to be used with SPI/Semicon’s Bumped and RM series of Horizontal Wafer Shippers. Wafer Separator Rings are used for transporting Bumped Wafers so that contact is only made within the SEMI Standard Exclusion Zone.

FEATURES

• Designed specifically for use with SPI/Semicon’s BHWS and HWS-RM Horizontal Wafer Shippers
• Manufactured with the industry’s cleanest, high-purity
  polypropylene material
• Minimal outgassing, trace metals, and ionics
• Unparalleled shipping and impact protection
• Compatible with automated packing, unpacking, & sorting equipment
• Can be used to transport up to 25 Wafers (with BHWS Wafer Shipper)
• Can be used to transport up to 13 Bumped Wafers
  (with HWS-RM Wafer Shipper)