Fine Pitch Gull Wing Devices
Fine Pitch Gull Wing Devices
- Individual device protection
- Black conductive or clear antistatic PVC
- Clear antistatic allows for easy identification
- Reopens and closes without generating static charge
- EIA and EIAJ sizes
- Gull wing leads “float” ensuring leading protection
- Trays available with reinforced bottoms
- Tray sizes 7.5 x 7.5 and 9 x 11
- Part Numbers Add “C” For Conductive Add “A” For Antistatic
- Clear impregnated static dissipative PVC or PETG.
- Standard Thickness are .020″, .030″, .035″ and .050″
- This Material meets or exceeds the EIA-541 and ESO/ESD S.11.11 requirements for resistivity and static
- decay at 12% relative humidity
- Black conductive high impact polystyrene, standard thickness .020″ and .030″
| Strip Pack Sizes Available | ||
| Part Number | No. of Cavities | Cavity Dimensions |
| SP-GW100 | 10 | 1.00 X .75 |
| SP-GW132 | 15 | 1.20 X 1.20 |
| SP-GW164 | 8 | 1.30 X 1.30 |
| SP-GW32 | 10 | .32 X .32 |
| SP-GW39 | 10 | .39 X .39 |
| SP-GW51 | 10 | .51 X .51 |
| Tray Sizes Available | ||
| Part Number | No. of Cavities | Cavity Dimensions |
| GW15 | – | LID |
| GW15T | 15 | .875 X .875 |
| GW15B | 15 | .875 X 875 |
| SP-GW100 | 25 | .875 x .875 |
| SP-GW132 | 15 | 1.20 X 1.20 |
| SP-GW164 | 15 | 1.55 X 1.55 |
| SP-G224 | 20 | 1.70 X 1.70 |
| SP-GW39-51 (Cover) | – | LID |
| SP-GW32 Bottom Works With GW39-51 Lid | 10 | .32 X .32 |
| SP-GW39 Bottom Works With GW39-51 Lid | 10 | .39 X .39 |
| SP-GW51 Bottom Works With GW39-51 Lid | 10 | .51 X .51 |
Device Trays
- Individual device protection
- Black conductive or clear antistatic PVC
- Trays stack for volume handling and shipping
- Lids available for most trays
- Part numbers: Add “C” For Conductive, Add “A” For Antistatic
- Clear impregnated static dissipative PVC or PETG.
- Standard Thickness are .020″, .030″, .035″ and .050″
- This Material meets or exceeds the EIA-541 and ESO/ESD S.11.11 requirements for resistivity and static
- decay at 12% relative humidity
- Black conductive high impact polystyrene, standard thickness .020″ and .030″
Sizes Available |
|||
| Part Number | No. of Cavities | Cavity Dimensions | Typical Device |
| TR-ACR25T | 25 | Form Fit | Microwave |
| TR-CCT5 | 5 | 1.20 x 1.20 x .312 | PLCC-LCC Chip Carrier |
| TR-CCT | 20 | 20 .85 X .52 X .312 | PLCC-LCC Chip Carrier |
| TR-CCT25 | 25 | .52 X .52 X .312 | PLCC-LCC Chip Carrier |
| TR-FM15 | 15 | .680 x .680 x .130 | Various |
| TR-FPC 100T | 100 | 1.000 x .750 | Flat Pack Carrier |
| TR-FPT 12C | 12 | 2.250 x 2.260 | Cerquad Flat Leads and Frame |
| TR-GW | 15 | Top/Bot. 15 .875 x .875 x .125 | Fine Pitch Gull Wing |
| TR-GW 15B | 15 | .875 x .875 x .250 | Fine Pitch Gull Wing with Bumpers |
| TR-HPS1 | 25 | 1.20 x 1.20 x .375 | Pin Grid Array |
| TR-HPS2 | 15 | 1.10 X 2.20 X .375 | Substrates |
| TR-HPS3 | 8 | 1.50 x 3.375 x .375 | Substrates |
| TR-HPT25 | 25 | 1.56 X .890 X .180 | Substrates |
| TR-HYB25 | 25 | 2.000 X 1.000 | Large Hybrid Substrates |
| TR-HYT18 | 18 | 2.30 X .60 X .300 | Substrates |
| TR-J44T | 36 | – | 44 Lead Chip Carrier |
| TR-LF150T | 150 | – | Lead Frames |
| TR-LF150TA | 150 | – | Lead Frames |
| TR-MET1 | 60 | 1.00 x .562 x .125 | Microwave |
| TR-PCC-20 | 20 | 1.775 x 1.775 124 | Lead PLCC |
| TR-PGA-15 | 15 | 1.62 x 1.62 .400 | Pin Grid Arrays |
| TR-PGA-15A | 25 | 1.324 x 1.324 x .360 | Pin Grid Arrays |
| TR-PGA25B | 25 | 1.324 x 1.324 x .3660 | Pin Grid Arrays with Center Bumps |
| TR-PGALID | – | – | Pin Grid Arrays |
| TR-SCX16T | 16 | Form Fit | Transducers |
| TR-SPX1T | 20 | Form Fit | Transducers |
| TR-SS40T | 40 | Form Fit | Substrates |
| TR-TO66 | 25 | Form Fit | TO-66 |
| TR-TO220 | 60 | Form Fit | TO-220 Device |
| TR-WT | 6 | T 6 3.375 x 3.375 x 1875 | 3″ Wafers |
Pins & End Plugs
Pins & End Plugs
- Manufactured in our new Utah facility on state-of the-art equipment.
- Precision plastic profiles to your specifications.
- On-line printing and cut lengths controlled by microprocessors.
- All above profiles and many more are presently tooled and available for quick delivery.
- New or custom shaped will be quoted promptly.
IC Shipping Tubes
IC Shipping Tubes
- Manufactured in our new Utah facility on state-of the-art equipment.
- Precision plastic profiles to your specifications.
- On-line printing and cut lengths controlled by microprocessors.
- All above profiles and many more are presently tooled and available for quick delivery.
- New or custom shaped will be quoted promptly
200 mm VWS WaferShipper
200 mm VWS WaferShipper™
Overview
The Texchem Advanced Products 200mm VWS Vertical WaferShiper™ is an industry accepted design providing superior protection for critical wafer handling requirements. The 200mm VWS is designed for transporting up to 25 full thickness wafers inside of a standardized vertical orientation package. By working closely with our material suppliers we develop the cleanest materials for low ionics and outgassing, resulting in an ultra clean, polypropylene material for prime wafer handling.
The 200mm VWS WaferShipper™ is designed to closely match the exterior and interior cassette package size of existing products that are widely used in the industry with components that are compatible with automated wafer loading and unloading equipment.
Features
- Package size and dimensions closely matches existing products that are widely used in the industry
- Manufactured with the industry’s cleanest, high-purity polypropylene material
- Minimal outgassing, trace metals, and ionics
- Unparalleled shipping and impact protection
- Secure, easy to use assembly.
- Orientation features for proper cassette/base alignment
- Compatible with automated loading and unloading equipment
- Houses up to 25 Wafers
- Competitively Priced
Specifications
- L x W x H: 263mm x 260mm x 237mm
- Each package is double clean room bagged
- Part name: 200mm VWS
- Part number: VWS200-A1
150 mm VWS WaferShipper
150 mm VWS WaferShipper™
Overview
The Texchem Advanced Products 150mm VWS Vertical WaferShiper™ is an industry accepted design providing superior protection for critical wafer handling requirements. The 150mm VWS is designed for transporting up to 25 full thickness wafers inside of a standardized vertical orientation package. By working closely with our material suppliers we develop the cleanest materials for low ionics and outgassing, resulting in an ultra clean, polypropylene material for prime wafer handling.
The 150mm VWS WaferShipper™ is designed to closely match the exterior and interior cassette package size of existing products that are widely used in the industry with components that are compatible with automated wafer loading and unloading equipment.
Features
- Package size and dimensions closely matches existing products that are widely used in the industry
- Manufactured with the industry’s cleanest, high-purity polypropylene material
- Minimal outgassing, trace metals, and ionics
- Unparalleled shipping and impact protection
- Secure, easy to use assembly.
- Orientation features for proper cassette/base alignment
- Compatible with automated loading and unloading equipment
- Houses up to 25 Wafers
- Competitively Priced
Specifications
- L x W x H: 203mm x 164mm x 185mm
- Each package is double clean room bagged
- Part name: 150mm VWS
- Part number: VWS150-A1
100 mm VWS WaferShipper
100 mm VWS WaferShipper™
Overview
The Texchem Advanced Products 100mm VWS Vertical WaferShiper™ is an industry accepted design providing superior protection for critical wafer handling requirements. The 100mm VWS is designed for transporting up to 25 full thickness wafers inside of a standardized vertical orientation package. By working closely with our material suppliers we develop the cleanest materials for low ionics and outgassing, resulting in an ultra clean, polypropylene material for prime wafer handling.
The 100mm VWS WaferShipper™ is designed to closely match the exterior and interior cassette package size of existing products that are widely used in the industry with components that are compatible with automated wafer loading and unloading equipment.
Features
- Package size and dimensions closely matches existing products that are widely used in the industry
- Manufactured with the industry’s cleanest, high-purity polypropylene material
- Minimal outgassing, trace metals, and ionics
- Unparalleled shipping and impact protection
- Secure, easy to use assembly.
- Orientation features for proper cassette/base alignment
- Compatible with automated loading and unloading equipment
- Houses up to 25 Wafers
- Competitively Priced
Specifications
- L x W x H: 163mm x 146mm x 120mm
- Each package is double clean room bagged
* Part name: 100mm VWS
* Part number: VWS100-A1
300 mm HWS-RM WaferShipper
300 mm HWS-RM WaferShipper™
Overview
The Texchem Advanced Products 300mm HWS-RM Horizontal WaferShiper™ is a unique design providing superior protection and substantial freight cost savings versus competitor HWS and FOSB models. The 300mm HWS-RM is designed for transporting up to 25 thin to full thickness wafers using carbon loaded or non-woven interleaves. By working closely with our material suppliers we develop the cleanest materials for ionics and outgassing, resulting in an ultra clean, carbon filled polypropylene that provides ESD protection.
All 300mm WaferShipper™ products are designed to meet SEMI Standard load port specifications to be compatible with automated wafer packing, unpacking, and sorting equipment.
Our unique, patent pending moveable wall design secures the wafers as the cover is closed. The edge-grip support “hugs” the wafers, limiting wafer movement and reducing particle generation. The WaferShipper™ provides unprecedented lateral shock protection by holding the entire stack of wafers radially, unlike competitor models which offer either no radial protection, or only hold the top several wafers. External forces and impacts are effectively directed to the shipper itself while the wafers remain safe.
Features
- Manufactured with the industry’s cleanest, high-purity polypropylene material
- Minimal outgassing, trace metals, and ionics
- Unparalleled shipping and impact protection
- Edge-grip support “hugs” the wafers, limiting wafer movement and reducing particulation
- Secure, easy to use four latch locking mechanism
- Arrowed, notch feature for proper top/base alignment
- Designed to meet SEMI Standards
- RF Tag Housing in the base for inventory and process management
- Compatible with automated packing/unpacking/sorting equipment
- Houses up to 25 Wafers using Carbon or Non-Woven Interleaves
- Houses up to 13 Bumped Wafers using Wafer Separator Rings (pn WSR300-R1)
Specifications
- L x W x H: 326mm x 326mm x 76mm
- Each package is double clean room bagged
- Part name: 300mm HWS-RM
- Part number: HWS-RM300-A1
200 mm HWS-RM WaferShipper
200 mm HWS-RM WaferShipper™
Overview
The Texchem Advanced Products 200mm HWS-RM Horizontal WaferShiper™ is a unique design providing superior protection versus competitor HWS models. The 200mm HWS-RM is designed for transporting up to 25 thin to full thickness wafers using carbon loaded or non-woven interleaves. By working closely with our material suppliers we develop the cleanest materials for ionics and outgassing, resulting in an ultra clean, carbon filled polypropylene that provides ESD protection.
The 200mm HWS-RM WaferShipper™ is designed to closely match the exterior package size of existing products that are widely used in the industry and is compatible with most automated wafer packing, unpacking, and sorting equipment.
Our unique, patent pending moveable wall design secures the wafers as the cover is closed. The edge-grip support “hugs” the wafers, limiting wafer movement and reducing particle generation. The WaferShipper™ provides unprecedented lateral shock protection by holding the entire stack of wafers radially, unlike competitor models which offer either no radial protection, or only hold the top several wafers. External forces and impacts are effectively directed to the shipper itself while the wafers remain safe.
Features
- Package size and dimensions closely matches existing products that are widely used in the industry.
- Manufactured with the industry’s cleanest, high-purity polypropylene material
- Minimal outgassing, trace metals, and ionics
- Edge-grip support “hugs” the wafers, limiting wafer movement and reducing particulation
- Unparalleled shipping and impact protection
- Secure, easy to use four latch locking mechanism
- Arrowed, notch feature for proper top/base alignment
- RF Tag Housing in the base for inventory and process management
- Compatible with most automated packing/unpacking/sorting equipment
- Houses up to 25 Wafers using Carbon or Non-Woven Interleaves
- Houses up to 13 Bumped Wafers using Wafer Separator Rings (pn WSR200-R1)
Specifications
- L x W x H: 226mm x 226mm x 69mm
- Internal Height: 31mm
- Each package is double clean room bagged
- Part name: 200mm HWS-RM
- Part number: HWS-RM200A2
200mm BHWS WaferShipper
200mm BHWS WaferShipper™
Overview
The Texchem Advanced Products 200mm Bumped Horizontal WaferShiper™ is a unique design providing superior protection versus competitor HWS models. The 200mm BHWS is designed for transporting up to 25 full thickness “Bumped” wafers using our Wafer Separator Rings (pn WSR200-R1). By working closely with our material suppliers we develop the cleanest materials for ionics and outgassing, resulting in an ultra clean, carbon filled polypropylene that provides ESD protection.
The 200mm BHWS WaferShipper™ is designed to be compatible with most automated wafer packing, unpacking, and sorting equipment.
Our unique, patent pending moveable wall design secures the wafers as the cover is closed. The edge-grip support “hugs” the wafers, limiting wafer movement and reducing particle generation. The WaferShipper™ provides unprecedented lateral shock protection by holding the entire stack of wafers radially, unlike competitor models which offer either no radial protection, or only hold the top several wafers. External forces and impacts are effectively directed to the shipper itself while the wafers remain safe.
Features
- Manufactured with the industry’s cleanest, high-purity polypropylene material
- Minimal outgassing, trace metals, and ionics
- Unparalleled shipping and impact protection
- Edge-grip support “hugs” the wafers, limiting wafer movement and reducing particulation
- Secure, easy to use four latch locking mechanism
- Arrowed, notch feature for proper top/base alignment
- RF Tag Housing in the base for inventory and process management
- Compatible with automated packing/unpacking/sorting equipment
- Houses 1-25 Wafers using Wafer Separator Rings (pn WSR200-R1)
Specifications
- L x W x H: 226mm x 226mm x 69mm
- Internal Height
- Each package is double clean room bagged
- Part name: 200mm BHWS
- Part number: BHWS200-A5
- Ring part number: WSR200-R1