Browsing articles tagged with "Semicon Archives | SPI Semicon"

About

  //   by spisemicon   //   About  //  No Comments
Semiconductor Packaging

Our manufacturing facility in Ogden, Utah

SPI/Semicon was formed by combining two of the industry leaders in Semiconductor packaging, Semicon Systems and Semiconductor Products.  Semicon Systems began in 1970 making containers for transport and storage of silicon wafers, which was an emerging industry at the time.  Semiconductor Products was launched in 1987 as a division of Professional Plastics and competed head to head with Semicon Systems.  In 1995 Semicon Systems was purchased by Semiconductor Products and the current company was formed and named SPI/Semicon.  Professional Plastics is still the parent company of SPI/Semicon.

SPI/Semicon remains at the forefront of wafer transport and storage systems, but has expanded their semiconductor packaging offering to include a wide range of products beyond just wafer packaging.  Our Engineering Department has developed new products that protect items from the front end of wafer fabrication all the way to the very back end after a component has been produced until it is installed in a finished consumer product.

Our company’s capabilities have greatly expanded over the decades.  SPI/Semicon has a large state-of-the-art manufacturing facility in Ogden Utah.  Our “in-house” capabilities include injection molding, deep draw vacuum forming, and high speed in-line vacuum forming, die cutting, shape and tube extrusion, CNC machining, custom fabrication, assembly and testing.

SPI/Semicon expanded their worldwide presence to Asia in the year 2000 opening a fully integrated manufacturing facility in Cavite, Philippines.  Our Philippine operation has the same capabilities of our Utah facility, but with ten times the capacity of IC tube production.

Both of our manufacturing facilities are certified to ISO 9001 and our products are RoHs compliant.

SPI/Semicon has highly trained personnel in many countries to service our worldwide presence in the Semiconductor Industry.  And we have the ability to design products through our engineering group to meet the ever changing products that electronics manufacturers are creating.  We pride ourselves on our customer service, listening to our customers’ needs, then reacting quickly with solutions.

SPI/Semicon Mission

  //   by spisemicon   //   About, Our Mission  //  Comments Off on SPI/Semicon Mission

The mission of SPI/Semicon:

To provide the most innovative and highest quality protective packaging for wafer and component protection in the semiconductor industry.

ISO 9008:2008

  //   by spisemicon   //   About  //  Comments Off on ISO 9008:2008

SPI/Semicon has received international recognition for the quality of its systems with the awarding of the prestigious ISO 9001:2008 certification. Under the requirements of the ISO 9008:2008 certification, an organisation needs to demonstrate its ability to consistently provide products or services and to enhance customer satisfaction in order to meet customer statutory and regulatory requirements.

We strive for excellence and receiving the ISO 9008:2008 certification is something we are very proud of as a company.

 

 

100 mm VWS WaferShipper

  //   by spisemicon   //   100 mm VWS WaferShipper, Wafer Containers  //  Comments Off on 100 mm VWS WaferShipper

100 mm VWS WaferShipper™

Overview

The Texchem Advanced Products 100mm VWS Vertical WaferShiper™ is an industry accepted design providing superior protection for critical wafer handling requirements.  The 100mm VWS is designed for transporting up to 25 full thickness wafers inside of a standardized vertical orientation package.  By working closely with our material suppliers we develop the cleanest materials for low ionics and outgassing, resulting in an ultra clean, polypropylene material for prime wafer handling.

The 100mm VWS WaferShipper™ is designed to closely match the exterior and interior cassette package size of existing products that are widely used in the industry with components that are compatible with automated wafer loading and unloading equipment.

Features

  • Package size and dimensions closely matches existing products that are widely used in the industry
  • Manufactured with the industry’s cleanest, high-purity polypropylene material
  • Minimal outgassing, trace metals, and ionics
  • Unparalleled shipping and impact protection
  • Secure, easy to use assembly.
  • Orientation features for proper cassette/base alignment
  • Compatible with automated loading and unloading equipment
  • Houses up to 25 Wafers
  • Competitively Priced

 

Specifications

  • L x W x H: 163mm x 146mm x 120mm
  • Each package is double clean room bagged

* Part name: 100mm VWS

* Part number:  VWS100-A1

300 mm HWS-RM WaferShipper

  //   by spisemicon   //   300 mm HWS-RM WaferShipper, Wafer Containers  //  Comments Off on 300 mm HWS-RM WaferShipper

300 mm HWS-RM WaferShipper

Overview

The Texchem Advanced Products 300mm HWS-RM Horizontal WaferShiper™ is a unique design providing superior protection and substantial freight cost savings versus competitor HWS and FOSB models.  The 300mm HWS-RM is designed for transporting up to 25 thin to full thickness wafers using carbon loaded or non-woven interleaves.  By working closely with our material suppliers we develop the cleanest materials for ionics and outgassing, resulting in an ultra clean, carbon filled polypropylene that provides ESD protection.

 

All 300mm WaferShipper™ products are designed to meet SEMI Standard load port specifications to be compatible with automated wafer packing, unpacking, and sorting equipment.

 

Our unique, patent pending moveable wall design secures the wafers as the cover is closed. The edge-grip support “hugs” the wafers, limiting wafer movement and reducing particle generation. The WaferShipper™ provides unprecedented lateral shock protection by holding the entire stack of wafers radially, unlike competitor models which offer either no radial protection, or only hold the top several wafers. External forces and impacts are effectively directed to the shipper itself while the wafers remain safe.

Features

  • Manufactured with the industry’s cleanest, high-purity polypropylene material
  • Minimal outgassing, trace metals, and ionics
  • Unparalleled shipping and impact protection
  • Edge-grip support “hugs” the wafers, limiting wafer movement and reducing particulation
  • Secure, easy to use four latch locking mechanism
  • Arrowed, notch feature for proper top/base alignment
  • Designed to meet SEMI Standards
  • RF Tag Housing in the base for inventory and process management
  • Compatible with automated packing/unpacking/sorting equipment
  • Houses up to 25 Wafers using Carbon or Non-Woven Interleaves
  • Houses up to 13 Bumped Wafers using Wafer Separator Rings (pn WSR300-R1)

 

Specifications

  • L x W x H: 326mm x 326mm x 76mm
  • Each package is double clean room bagged
  • Part name: 300mm HWS-RM
  • Part number: HWS-RM300-A1

 

 

Our Mission

  //   by spisemicon   //   About  //  Comments Off on Our Mission


Our day-to-day commitment is to provide the best quality, best delivery and the best attention to every detail of our business that is humanly possible.

 

We promise to remain in the forefront of technology, seeking new and innovative ways to “get the job done right”… this is our pledge.

SPI/Semicon North America

  //   by spisemicon   //   About, SPI/Semicon North America  //  No Comments

SPI/Semicon was formed in 1970 for the purpose of supplying products to the Semiconductor Industry.

We manufacture products for the semiconductor front-end (wafer fabrication) and back-end (finished devices). Our products are used to protect wafer and device damage during handling, testing, and shipping. We design and produce products to our specifications at manufacturing sites in Utah and Philippines. We utilize plastic injection molding, extrusion and vacuum-forming for manufacturing our products.

SPI/Semicon products are used to protect wafers and devices from damage during handling, testing and shipping, often from the US to many other countries. We design and produce products to our specifications and then warehouse the products for prompt customer delivery. We utilize many methods of manufacturing, such as extrusion, vacuum forming, injection molding and die cutting. We are proud of our unique designs and history of quality products.

On April 1, 1990, SPI/Semicon opened a new plant in Ogden, Utah. The factory is a equipped with the latest designs for producing shipping tubes for I.C.’s, with in-line printing and bow control. The factory also has injection molding presses, vacuum forming equipment and operates die cutting presses to produce custom parts and other company products, and utilizes computer assisted quality control.

SPI/Semicon prides itself on a philosophy of customer service. We listen to our customers’ problem , react by offering our appropriate existing products or creative new solutions. We endeavor to provide our customers with prompt, courteous service and quality products and fair prices.

 

No Fields Found.

Corporate Headquarters

2670 South Commerce Way
Ogden, UT 84401
Tel: 801.399.5723
Fax: 801.393.7559
Toll Free: 1.888.295.5906

Quick Navigation